Electronic Circuits and Diagram-Electronics Projects and Design

Chemical Vapor Deposition Process In this article, Chemical Vapor Deposition process is explained in detail. The epitaxial deposition, uses, and also the epitaxial growth of silicon is explained in detail. Doping and Autodoping, Epitaxial Reactors, Epitaxial Growth Process, their advantages and disadvantages are also explained. The different types of CVD reactors and their advantages and disadvantages are also explained briefly. To know the various steps that are used to fabricate silicon devices, click on the link below. TAKE A LOOK : IC FABRICATION TECHNIQUES Related Articles TAKE A LOOK : SILICON SUBSTRATE PREPARATION TAKE A LOOK : OXIDATION PROCESS Chemical…

Silicon Substrate Preparation Process In this article the details on how a silicon substrate is prepared is given.We have structured the article into 5 sections as give below for easy and effective reading. 1. The silicon crystal growth 2. Electronic grade silicon production 3. Czochralski Crystal Growth Process 4. Wafer preparation 5. Wafer processing If you don’t have a basic idea of IC Fabrication, we have a detailed article on the subject. Visit the link given below. TAKE A LOOK : IC FABRICATION TECHNIQUES Silicon Crystal Growth The most commonly available natural sources of silicon are silica and silicates. At…

IC Fabrication Techniques In this article, the different processing techniques that are needed for IC , transistor and diode fabrication are listed. A small procedure of the fabrication process is also explained. In a monolithic IC, all the circuit components are fabricated into or top of a block of silicon which is referred to as chip or die. Metallization patterns are required to make interconnections between the components present inside the chip. It must also be noted that the individual components will not be separable from the circuit. The processing steps used to fabricate various silicon devices, such as diodes,…

Introduction In the earlier 60’s it was discrete logic used by electronic industry. The digital system would look like noodle like maze of wiring between components. Once it is built it will be difficult to do rework on it. Sometimes the designers would forget what they have designed for! Manufacturing such systems was very difficult and redesign will be so eye-shutting just like making a PCB every time we redesign. The chip manufactures resolved this issue by placing an unconnected array of AND-OR gates in a single chip device called a programmable logic device (PLD). The PLD contains an array…

Cadence Design Framework II All the tools from cadence for the VLSI design process use the same unique database called Design Framework II (DFII). It is a binary database that stores the data as objects. In the world of Electronic Design Automation (EDA), there are different types of objects and each representing a distinct concept. The cellviews, symbols, instances, terminals etc are different types of objects. The Design Framework II database can store both the physical information as well as the logical information of a design. The physical information includes geometrical shapes of IC layout. Logical information includes nets and…

The chip design includes different types of processing steps to finish the entire flow. For anyone, who just started his carrier as a VLSI engineer has to understand all the steps of the VLSI design flow to become  good in his area of operations. There are different types of design procedures for analog/digital designs and FPGA designs. The analog design is mainly focusing on the back end design of a chip while FPGA on front end design. Front End Design The steps involved are explained below. Design entry: It describes the RTL (Register Transfer Level) logics in HDLs. For this,…